This machine was acquired recently and is not yet set up for production.
Machine supports machining of all one-sided and double-sided board types in the usual packing density (FR3, FR4, FR5, G10), flexible substrates, RF substrates, drilling test adapters, structuring film patterns, producing solder frames for PCB assembly, SMD fine line technology, contour-milling, engraving of front panels or labels, depth milling of rigid or flexible boards, depaneling and reworking of populated and unpopulated boards, machining of housings and multilayers up to 8 layers in combination with MiniContac III and MultiPress-II.